OKUNO’s plating and surface finishing technology for PWBs and IC substrates

Surface finishing technology to glass core substrates

• Highly adhesive plating process on glass “TORIZING PROCESS”
• Acid copper plating additive for through-hole filling to glass core substrates “TOP LUCINA GCS series”

Plating technology for packaging substrates

• Electroless copper plating process for next-generation semiconductor packaging
• Acid copper plating additive for high-current density, fine pattern via filling “TOP LUCINA NSV ADV”
• Acid copper plating additive for large diameter via filling “TOP LUCINA NSV LV ”
• Electroless Ni/Pd/Au plating process for high joint reliability for pakcage substrate

Plating technology to PCB

• Acid copper plating additive for MSAP for via filling and through-hole plating “TOP LUCINA VT ”
• Acid copper plating additive to high aspect ratio “TOP LUCINA HLS ”
• Electroless Ni/Au plating process for high joint reliability for FPC and rigid PWB

Plating technology for semiconductor wafer

• Acid copper plating additives for semiconductor wafer “TORYZA LCN series ”
• Acid copper plating additive for Cu-Cu hybrid bonding “TORYZA LCN LXD ”
• UBM formation on aluminum electrode on wafer “TORYZA EL PROCESS ”
• Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”

Plating technonogy to sintered circuit boards

• Electroless plating process for insulated dissipation substrate for power modules
• Electroless Ni-B plating process for sintered conductive circuits on ceramic substrates “TOP FCP PROCESS”