OKUNO’s plating and surface finishing technology for PWBs and IC substrates
Plating technology for semiconductir wafer
- UBM formation for Al electrode on wafer “TORYZA EL PROCESS”
- Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”
- Acid copper plating additive for wafer “TORYZA LCN series”
Plating technology for IC substrates
- Electroless copper plating process to solve Weak-Micro Via “OPC FLET PROCESS”
- Acid copper plating additive for high-current density, fine pattern via filling “TOP LUCINA NSV ADV”
Acid copper plating additive for large diameter vias “TOP LUCINA NSV LV”
The latest surface finishing for power device
- For fine pattern formation, high joint reliability electroless nickel/gold plating process
- Electroless plating process for power module
- Electroless nickel-boron plating process on metal ink pastes of sintered substrates “TOP FCP PROCESS”
- Highly-reliable granular copper plating technology with high adhesion to molding materials “TOP CLUSTER AR”
- Acid copper plating additives for through-hole filling to glass substrates “TOP LUCINA GCS series”
- Highly adhesive plating process on glass “TORIZING PROCESS”